★会议主页：https://www.icicm.net/chinese.html
欢迎广大作者投稿至icicm@young.ac.cn邮箱或通过网上投稿系统投稿 
请通过此链接下载文章模板：https://icicm.net/Template.doc (Word)  https://icicm.net/WIN-or-MAC-LaTeX2e-Transactions-Style-File.zip (Latex)

★出版和检索说明
本次会议收录的文章将作为会议论文集出版并被IEEE Xplore，Ei Compendex和Scopus检索。

★审稿委员会
Prof. Xiaoxiao Wang, BeiHang University, China
Prof. Bo Yan, University of Electronic Science & Technology of China, China
Prof. Dr. Ashutosh Kumar Singh, National Institute of Technology, Kurukshetra, India
Assis. Prof. Hossein Fariborzi, King Abdullah University of Science and Technology, Saudi Arabia
Assoc. Prof. Hamed Alipour-Banaei, Islamic Azad University, Iran
Assoc. Prof. Tiejun Chen, Yiyang Medical College, China
Assis. Prof. Weiguang Sheng, Shanghai Jiao Tong University, China
Prof. Changchun Zhang, Shanghai University of Posts and Telecommunication / Southeast University, China
Assis. Prof. Yu Bai, California State University Fullerton, USA
Prof. Jinzhao Wu, Guangxi University for Nationalities, China
Prof. Shiwei Feng, Beijing University of Technology, China
Assoc. Prof. Wei Ni, Hefei University of Technology, China
Prof. Xingyuan Tong, Xi'an University of Posts & Telecommunications,China
Prof. Jinyan Wang, Peking University, China
Prof. Zhi-Jian Xie, NC A&T State University, USA
Prof. S. Ushakumari, College of Engineering Trivandrum, India
Prof. Lu Tang, Southeast University, China
Prof. Haizhi Song, University of Electronic Science and Technology of China, China
Prof. Tang Bin, Chengdu Aeronautic Polytechnic, The Innovation Base of School-Enterprise Cooperation Aviation Electronic Technology in Sichuan, China
Prof. Shiwei Feng, Beijing University of Technology,China
Assoc.Prof. Quanzhen Duan,Tianjin University of Technology, China
Assoc.Prof. Yue Ming Ding,Tianjin University of Technology,China
Prof.Shengming Huang,Tianjin University of Technology, China
Prof. Fei Yuan, Ryerson University, Canada
Assoc. Prof. Guolin Sun, Beihang University, China
Assoc. Prof. Yuan-Hao Huang, National Tsing Hua University,Taiwan
Asst. Prof. Dr. Najam Muhammad Amin, Bahria University, Pakistan
Prof. Dr.Qifeng Xu, Fuzhou University, China
更多委员会成员请参见官网https://www.icicm.net/committee.html

★会议历史--ICICM会议连续4年都是IEEE出版

2019年的会议论文收录的文章已全被录入IEEE Xplore数据库。
Electronic ISBN: 978-1-7281-5132-8 | USB ISBN: 978-1-7281-5131-1

2018年的会议论文集已被IEEE Xplore数据库收录,并已被EI核心和Scopus等检索。
Electronic ISBN: 978-1-5386-8311-8 | USB ISBN: 978-1-5386-8310-1 | Print on Demand(PoD) ISBN: 978-1-5386-8312-5
 
2017年的会议论文收录的文章全被录入IEEE Xplore数据库，并已被EI核心和Scopus等检索。
Electronic ISBN: 978-1-5386-3506-3 | Print ISBN: 978-1-5386-3505-6 | DVD ISBN: 978-1-5386-3504-9 | Print on Demand(PoD) ISBN: 978-1-5386-3507-0

2016年的会议论文收录的文章全被录入IEEE Xplore数据库，并已被EI核心和Scopus等检索。
Electronic ISBN: 978-1-5090-2814-6 | Print ISBN: 978-1-5090-2813-9 | Print on Demand(PoD) ISBN: 978-1-5090-2815-3 

★征稿主题包括但不限于以下内容
数字、模拟、混合信号IC和SOC设计技术
硅集成电路与制造
低功率、射频设备和电路
集成电路计算机辅助设计技术
硅锗器件与器件物理
互连、低K、高K等工艺技术
非常规和纳米电子学
有机半导体器件与技术
复合半导体器件和电路
显示器、传感器和MEMS
半导体材料与材料特性
包装检测技术
太阳能电池及其他新能源设备
建模与仿真
设备技术
可靠性
显示器、传感器和MEMS
高级存储技术（闪存、FERAM、PCM、RERAM、MRAM等）